Plating
Equipment
ReynoldsTech offers a complete complement of tooling for your plating/metal deposition process needs. Our design/build services allow us to bring to our users not only standard configurations but a full range of custom process systems. Our systems are available from simple manual units to fully automatic multi-tasking units operating in a mini-environment. All of our plating systems can be equipped with a graphical user interface unit for a more sophisticated process control.
​
Supported Processes
ReynoldsTech develops plating cells and systems for both Single Wafer Processing or Batch Immersion Processing. Our plating systems are available in manual, semi-automatic, or fully automatic versions and support:
​
-
Electrochemical Plating​
-
Electroless Plating
-
Metal Deposition
-
TSV Plating
-
Surface Preparation
-
Periodic Reverse Pulse Plating
-
Copper, nickel, chromium, zinc, tin, gold, palladium, etc.
​
Process Equipment
ReynoldsTech also offers a complete complement of equipment that can be purchased as a stand-alone piece or can be integrated into a custom-built wet bench. If purchased as an individual piece of equipment, a unit can be equipped with optional controls, sensors, or screens as required for easy installation into an existing system. Examples of the equipment offered by ReynoldsTech are as follows:
​
-
Plating Cells
-
Custom Built Cathodic Fixturing – contact point fixtures and 360* contact ring fixtures for backside protection
-
Custom Anodes
-
Ionic Replenishment Wiper Assemblies
-
Ionic Replenishment Sparger Assemblies
-
Preparation Tooling
-
Automatic Spray/Rinse Systems
-
Liquid-Liquid Heating Elements